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案例1:Au80Sn20预成型焊环用于金属化光纤连接

案例2:半导体芯片封装焊片应用

Au80Sn20预成型焊片用于光电成像器件的盖板密封焊接
Au80Sn20应用建议
1. Au80Sn20预成型焊片焊接温度: 310℃~ 330℃,是一种很典型的低温共晶焊料请根据封装结构和材料特性制定焊接工艺;
2. 无需助焊剂,焊后无需清洗;
3. 为确保焊接质量,请于真空、保护性气氛下使用本产品。
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